With our expertise and experiences , please rest assure your devices and processes are in good hands.
Design and Fabrication Consultation
- Finite element analysis
- Mask design and layout
- Interface circuitry design
Microfabrication Processes
- Spin coat / Develop
- Positive and negative photoresist
- SU-8
- Photolithography (minimum feature size: 1 micron)
- Reactive ion etching
- Oxide
- Nitride
- Silicon
- Silicon Carbide
- Photoresist
- Wet etching
- Anisotropic KOH/TMAH
- Electrochemical etch stop
- BOE/HF
- Metal etch
- RCA1 and RCA2 clean
- Piranha clean
- Solvent clean
- Sacrificial layer release (CO2 superficial dryer)
- Furnace process
- Wet and dry oxidation
- LPCVD nitride
- LPCVD polysilicon
- Low temperature oxide (LTO)
- Thermal
diffusion
- Sintering
- Metallization
- Al, Au, Cr, Ni, Pd, Pt, Ti, W, and Al/Si/Cu Alloy
- Wafer to wafer bonding
- Ion implantation
- DRIE process
Inspection
- Thin film metrology
- Detek surface profiler
- Ellipsometer
- Nano Spec film analysis system
- Material analysis
Packaging and Testing Support
- Wire bonding
- Wafer dicing
- Package design
- Design testing apparatus
Please contact us for additional services not listed
here
